[RESCHNAR, Wilfried, BORGES, Stephan, LEUTHNER, Stephan, HACKENBERG, Juergen, WETZL, Franz] Postfach 30 02 20, 70442 Stuttgart, DE

[BORGES, Stephan, LEUTHNER, Stephan] Postfach 30 02 20, 70442 Stuttgart, DE

[RESCHNAR WILFRIED, BORGES STEPHAN, LEUTHNER STEPHAN, HACKENBERG JUERGEN, WETZL FRANZ] DE The present invention relates to a process for producing a structural member from plates (9, 10) stacked on top of each other, soldered together and provided with at least partial recesses. At least one solder layer (8) is provided between said plates (9, 10) in order to allow solder diffusion process. According to the invention, the plates (9, 10) are stacked on top of each other, separated from each other by solder diffusion layers (8), and then compressed in a cold condition before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided. The invention also relates to the use of the above-described process for the manufacture of a micro-heat exchanger.

[BORGES, Stephan, LEUTHNER, Stephan] Postfach 30 02 20 70442 Stuttgart;Boehrer-Strasse 32 71640 Ludwigsburg;Karlsbader Strasse 9 70372 Stuttgart The invention relates to a micro heat exchanger (10) with separate, vertically crossing channels (11, 12) that are disposed in alternating levels and that carry heat exchange media. The aim of the invention is to provide a heat exchanger that can be closely linked with further devices and components of the process circuit. To this end, the heat exchanger (10) is provided on two opposite faces with simple flange boards (20) so that a device connection area with flush ends of the channels (11, 12) is obtained.

[Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl] DE Stuttgart A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.

[BORGES, Stephan, LEUTHNER, Stephan] Postfach 30 02 20, 70442 Stuttgart, DE

[BORGES STEPHAN, LEUTHNER STEPHAN] DE

[BORGES STEPHAN, LEUTHNER STEPHAN] DE The micro heat exchanger has perpendicular flow channels (11,12) for 2 different heat transfer mediums arranged in alternating planes (E1,E2,..En), with the flow connections for each of the heat transfer mediums provided on the opposing side faces of the heat exchanger block (10). At least 2 of the opposing side faces have a reduced cross-section projection (13) for providing a mounting lip for a flange plate.

[Wilfried Reschnar, Stephan Borges, Stephan Leuthner, Juergen Hackenberg, Franz Wetzl] DE Schozach A method for producing a component out of stacked plates (9, 10) soldered to one another, into at least some of which recesses (11, 12, 13) are made, is proposed, in which at least one solder layer (8) is provided between the plates (9, 10) for a solder diffusion process. According to the invention, the plates (9, 10), with solder layers (8) between them, are stacked on one another and compressed in the cold state before the solder diffusion process. With this provision, the use of complicated pressing tools in the actual solder diffusion process is avoided.

[BORGES STEPHAN, LEUTHNER STEPHAN] DE The invention relates to a micro heat exchanger (10) with separate, vertically crossing channels (11, 12) that are disposed in alternating levels and that carry heat exchange media. The aim of the invention is to provide a heat exchanger that can be closely linked with further devices and components of the process circuit. To this end, the heat exchanger (10) is provided on two opposite faces with simple flange boards (20) so that a device connection area with flush ends of the channels (11, 12) is obtained.